VIA KT266A芯片組產(chǎn)品手冊(cè)

VIA KT266A芯片組產(chǎn)品手冊(cè)

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VIA KT266A芯片組產(chǎn)品手冊(cè).

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Confidential and ProprietaryMainstream AMD DDR Elusive
Many Solutions on the Market
n
Chipsets from VIA, AMD, ALi, and SiS
g
No Clear Performance/Feature Set
n
Leader
Motherboard manufacturers hedging
g
their bets, developing for all chipsets
Platform fragmentation slowing the
n
acceptance of DDR on AMD platforms
OEMs, System Integrators, End Users,
g
Channel confused by lack of clear
platform leadership
Confidential and ProprietaryVIA Leads DDR Platform
Development
First available P6 bus DDR chipset
n
VIA Apollo pro266 first available DDR-
g
SDRAM chipset for Intel? Pentium? III
processors
First mass produced K7 bus DDR chipset
n
VIA Apollo KT266 first widely available DDR-
g
SDRAM chipset for AMD Athlon? and
Duron? processors
First available P7 bus DDR chipset
n
VIA Apollo P4X266 brings DDR-SDRAM to the
g
Pentium 4 platform for the first time
Confidential and ProprietaryThe Definitive AMD DDR Chipset
VIA Apollo KT266A eliminates the
n
doubt
Performance Driven Design
g
Established Motherboard Base
g
V-MAP Scalability and Flexibility
g
Confidential and ProprietaryKT266A Chipset Block Diagram
Confidential and ProprietaryPerformance Driven Design
Enhanced Memory
n
Controller
Supports DDR200/DDR266
g
Tightened Timings
g
Decreases latency, increases
g
effective bandwidth
Deeper Queuing
g
Allows more instructions “in
g
flight”, hiding latency
penalties
New Abilities
g
Can burst up to eight Quad
g
Words in a clock cycle
Confidential and ProprietaryVIA Modular Architecture Platform
V-MAP
n
Multiple Pin-to-Pin
g
Compatible South Bridge
options
Drop-in replacement for
g
KT266
Future Pin-to-Pin
g
Compatible North Bridge
migration options
Seamless product
n
transitions on a single
motherboard platform
Faster Time to Market
g
Lower Product
g
Development,
Validation, and
Production costs
Confidential and ProprietaryAMD DDR Chipset Comparison
Feature AMD760 KT266A SiS735
North Bridge AMD761 VT8366A SiS735

AIGC

VIA KT266A芯片組產(chǎn)品手冊(cè)是針對(duì)VIA Technologies公司生產(chǎn)的KT266A型號(hào)主板北橋芯片的產(chǎn)品詳細(xì)說明書。該手冊(cè)包含了以下內(nèi)容： 1. 介紹與概述：對(duì)KT266A芯片組的基本特性進(jìn)行描述，如支持的處理器類型（如Athlon XP、 Duron等）、總線頻率、內(nèi)存規(guī)格（DDR SDRAM）、AGP插槽規(guī)范以及PCI-E接口兼容性等。 2. 系統(tǒng)要求：明確指出主板所需的電源、CPU、內(nèi)存、擴(kuò)展插槽（如AGP/PCI）以及其他必要硬件組件的規(guī)格要求。 3. 芯片組架構(gòu)與功能模塊：詳細(xì)介紹KT266A芯片組內(nèi)部各組成部分的功能，包括南北橋之間的連接、內(nèi)存控制器、IDE/SATA控制、USB、LAN（以太網(wǎng)）接口、聲卡集成等功能模塊及其工作原理和性能指標(biāo)。 4. BIOS設(shè)置指南：提供BIOS中關(guān)于系統(tǒng)時(shí)鐘頻率調(diào)節(jié)、內(nèi)存參數(shù)設(shè)置、AGP/PCI設(shè)備配置、啟動(dòng)順序調(diào)整等內(nèi)容的詳細(xì)說明，以便用戶能正確地進(jìn)行系統(tǒng)初始化和優(yōu)化。 5. 性能測試與兼容性列表：列出KT266A芯片組在不同配置下的典型性能表現(xiàn)，并給出與之兼容的操作系統(tǒng)版本、顯卡驅(qū)動(dòng)程序、聲卡驅(qū)動(dòng)程序等軟硬件信息。 6. 安裝與故障排除：指導(dǎo)用戶安裝主板的過程，以及在使用過程中可能遇到的問題及解決辦法。 7. 其他相關(guān)部分：可能還包括售后服務(wù)政策、聯(lián)系方式、安全警告等信息。總之，VIA KT266A芯片組產(chǎn)品手冊(cè)是為了幫助用戶全面理解并正確操作使用這款主板，從而充分發(fā)揮其性能潛力的重要參考資料。